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Tag Archives: Interposer

TSMC Unveils World’s Largest CoWoS Interposer

TSMC today announced it has collaborated with Broadcom on enhancing the Chip-on-Wafer-on-Substrate (CoWoS) platform to support the industry’s first and largest 2x reticle size interposer. With an area of approximately 1,700mm2, this next generation CoWoS …

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